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 HT9200A/HT9200B DTMF Generators
Features
* Operating voltage: 2.5V~5.5V * Serial mode for the HT9200A * Serial/parallel mode for the HT9200B * Low standby current * Low total harmonic distortion * 3.58MHz crystal or ceramic resonator * HT9200A: 8-pin DIP/SOP package
HT9200B: 14-pin SOP package
General Description
The HT9200A/B tone generators are designed for MCU interfaces. They can be instructed by a MCU to generate 16 dual tones and 8 single tones from the DTMF pin. The HT9200A provides a serial mode whereas the HT9200B contains a selectable serial/parallel mode interface for various applications such as security systems, home automation, remote control through telephone lines, communication systems, etc.
Selection Table
Function Part No. HT9200A HT9200B Operating Voltage 2.5V~5.5V 2.5V~5.5V OSC Frequency 3.58MHz 3.58MHz Interface Serial Serial/Parallel Package 8 DIP/SOP 14 SOP
Block Diagram
X1 X2
3 .5 8 M H z C r y s ta l/R e s o n a to r O s c illa to r
DTM F G e n e ra to r
DTM F
DATA CLK
S e r ia l D a ta In p u t C ir c u it
C o n tro l C ir c u it
P a r a l l e lD a t a I n p u tC ir c u it
CE
S /P
D3
D2
D1
D0
Pin Assignment
CE X2 2 3 4 5 6 7 8 X1 CE X2 1 8 2 7 3 6 4 5 X1 VSS VDD
DTM F
1
14 13 12 11 10 9
VDD DTM F DATA CLK S /P D3 D2
VSS NC D0 D1
DATA CLK
H T9200A 8 D IP -A /S O P -A
H T9200B 1 4 S O P -A
Rev. 1.40
1
August 30, 2004
HT9200A/HT9200B
Pad Assignment
CE X2 1 13 VDD 12 11 (0 ,0 ) X1 2 9 3 4 5 D1 6 7 D3 D2 8 S /P VSS D0 DTM F
Pad Coordinates
Pad No. 1 2
10 DATA CLK
Unit: mm Pad No. 8 9 10 11 12 13 X 553.30 553.30 553.30 553.30 374.90 -279.30 Y -523.50 -190.30 4.70 340.30 523.50 523.50
X -553.30 -553.30 -553.30 -553.30 -220.10 -25.10 308.10
Y 430.40 -133.50 -328.50 -523.50 -523.50 -523.50 -523.50
3 4 5 6 7
Chip size: 1460 1470 (mm)2 * The IC substrate should be connected to VSS in the PCB layout artwork.
Pin Description
Pin Name CE X2 X1 VSS NC I/O I O Oscillator I 3/4 3/4 3/4 3/4 CMOS IN Pull-high or Floating Internal Connection CMOS IN Chip enable, active low. No internal pull-high resistor. The system oscillator consists of an inverter, a bias resistor, and the required load capacitor on chip. The oscillator function can be implemented by Connect a standard 3.579545MHz crystal to the X1 and X2 terminals. Negative power suppl, ground No connection Data inputs for the parallel mode When the IC is operating in the serial mode, the data input terminals (D0~D3) are included with a pull-high resistor. When the IC is operating in the parallel mode, these pins become floating. Operation mode selection input S/P=H: Parallel mode S/P=L: Serial mode Data synchronous clock input for the serial mode When the IC is operating in the parallel mode, the input terminal (CLK) is included with a pull-high resistor. When the IC is operating in the serial mode, this pin becomes floating. Data input terminal for the serial mode When the IC is operating in the parallel mode, the input terminal (DATA) is included with a pull-high resistor. When the IC is operating in the serial mode, this pin becomes floating. Output terminal of the DTMF signal Positive power supply, 2.5V~5.5V for normal operation Description
D0~D3
I
S/P
I
CMOS IN
CLK
I
CMOS IN Pull-high or Floating CMOS IN Pull-high or Floating CMOS OUT 3/4
DATA
I
DTMF VDD
O 3/4
Rev. 1.40
2
August 30, 2004
HT9200A/HT9200B
Approximate Internal Connection Circuits
C M O S IN P u ll- h ig h
V
DD
CMOS OUT
V
DD
C M O S IN (F o r D 0 ~ D 3 , CLK,DATA)
V
DD
C M O S IN
O S C IL L A T O R
X1 20pF 10M X2 10pF EN
Absolute Maximum Ratings
Supply Voltage ..............................VSS-0.3V to VSS+6V Input Voltage ................................VSS-0.3 to VDD+0.3V Storage Temperature ............................-50C to 125C Operating Temperature...........................-20C to 75C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
Symbol VDD IDD VIL VIH ISTB Parameter Operating Voltage Operating Current 5.0V Low Input Voltage High Input Voltage Standby Current 5.0V RP tDE VTDC ITOL VTAC ACR RL 2.5V Pull-high Resistance 5.0V DTMF Output Delay Time (Parallel Mode) DTMF Output DC Level DTMF Sink Current DTMF Output AC Level Column Pre-emphasis DTMF Output Load 5V VOL=0V 3/4 3/4 3/4 2.5V Test Conditions VDD 3/4 2.5V Conditions 3/4 S/P=VDD,D0~D3=VSS, CE=VSS, No load 3/4 3/4 S/P=VDD,CE=VDD, no load Min. 2.5 3/4 3/4 VSS 0.8VDD 3/4 3/4 120 45 3/4 0.45VDD -0.1 0.12 1 5 Typ. 3/4 240 950 3/4 3/4 3/4 3/4 180 68 tUP+6 3/4 3/4 0.15 2 3/4 Max. 5.5 2500 3000 0.2VDD VDD 1 2 270 100 tUP+8 0.75VDD 3/4 0.18 3 3/4
Ta=25C Unit V mA V V mA
kW ms V mA Vrms dB kW
2.5V~ DTMF Output 5.5V 2.5V 2.5V 2.5V 2.5V VDTMF=0.5V Row group, RL=5kW Row group=0dB tHD -23dB
Rev. 1.40
3
August 30, 2004
HT9200A/HT9200B
Symbol tHD fCLK Parameter Tone Signal Distortion Clock Input Rate (Serial Mode) Oscillator Starting Time (When CE is low) System Frequency Test Conditions VDD 2.5V 3/4 Conditions RL=5kW 3/4 The time from CE falling edge to normal oscillator operation Crystal=3.5795MHz Min. 3/4 3/4 3/4 3.5759 Typ. -30 100 Max. -23 500 Unit dB kHz
tUP fOSC
5.0V 3/4
3/4 3.5795
10 3.5831
ms MHz
Rev. 1.40
4
August 30, 2004
HT9200A/HT9200B
Functional Description
The HT9200A/B are DTMF generators for MCU interfaces. They are controlled by a MCU in the serial mode or the parallel mode (for the HT9200B only). Serial Mode (HT9200A/B) The HT9200A/B employ a data input, a 5-bit code, and a synchronous clock to transmit a DTMF signal. Every digit of a phone number to be transmitted is selected by a series of inputs which consist of 5-bit data. Of the 5 bits, the D0(LSB) is the first received bit. The HT9200A/B will latch data on the falling edge of the clock (CLK pin). The relationship between the digital codes and the tone output frequency is shown in Table 1. As for the control timing diagram, refer to Figure 1. When the system is operating in the serial mode a pull-high resistor is attached to D0~D3 (for parallel mode) on the input terminal.
Table 1: Digits vs. Input Data vs. Tone Output Frequency (Serial Mode) Digit 1 2 3 4 5 6 7 8 9 0 * # A B C D 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 DTMF OFF D4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 D3 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 1 D2 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 1 1 1 1 1 D1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 1 1 0 0 1 1 1 D0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 0 1 0 1 0 1 1 Tone Output Frequency (Hz) 697+1209 697+1336 697+1477 770+1209 770+1336 770+1477 852+1209 852+1336 852+1477 941+1336 941+1209 941+1477 697+1633 770+1633 852+1633 941+1633 697 770 852 941 1209 1336 1477 1633 3/4
Note: The codes not listed in Table 1 are not used D4 is MSB
Rev. 1.40
5
August 30, 2004
HT9200A/HT9200B
For the HT9200B, the S/P pin has to be connected low for serial mode operation. Parallel Mode (HT9200B) The HT9200B provides four data inputs D0~D3 to generate their corresponding DTMF signals. The S/P has to be connected high to select the parallel operation mode. Then the input data codes should be determined. Finally, the CE is connected low to transmit the DTMF signal from the DTMF pin. The TDE time (about 6ms) will be delayed from the CE falling edge to the DTMF signal output. The relationship between the digital codes and the tone output frequency is illustrated in Table 2. As for the control timing diagram, see Figure 2. When the system is operating in the parallel mode, D0~D3 are all in the floating state. Thus, these data input pins should not float.
S /P X2 ( O s c illa to r ) CE
tU
P
CLK LSB DATA 1 D ig it 1 D ig it 2 MSB LSB MSB LSB 1 1 1 MSB 1
S to p c o d e
DTM F D ig it 1 D T M F s ig n a l D ig it 2 D T M F s ig n a l
Figure 1 Table 2: Digits vs. Input Data vs. Tone Output Frequency (Parallel Mode) Digit 1 2 3 4 5 6 7 8 9 0 * # A B C D D3 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 D2 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 D1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 D0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Tone Output Frequency (Hz) 697+1209 697+1336 697+1477 770+1209 770+1336 770+1477 852+1209 852+1336 852+1477 941+1336 941+1209 941+1477 697+1633 770+1633 852+1633 941+1633
Rev. 1.40
6
August 30, 2004
HT9200A/HT9200B
S /P X2 ( O s c illa to r ) CE
D0~D3
DTM F
tD
E
tD
E
N o te : T h e d a ta ( D 0 ~ D 3 ) s h o u ld b e r e a d y b e fo r e th e C E
Figure 2
b e c o m e s lo w .
Tone Frequency Output Frequency (Hz) Specified 697 770 852 941 1209 1336 1477 % Error does not contain the crystal frequency drift Actual 699 766 847 948 1215 1332 1472 %Error +0.29% -0.52% -0.59% +0.74% +0.50% -0.30% -0.34%
Rev. 1.40
7
August 30, 2004
HT9200A/HT9200B
Application Circuits
Serial Mode
V
DD
V VDD CE CLK VSS DATA 20pF 3 20pF 4 3 .5 7 9 5 4 5 M H z 1 2 CE X2 X1 VSS VD DTM DAT CL D F A K 5 6 7 8
DD
Tone O u tp u t
MCU
H T9200A
Serial/Parallel Mode
V
DD
V VDD CE D0 D1 D2 D3 S /P CLK DATA 3 .5 7 9 5 4 5 M H z 1 20pF 2 3 20pF 5 6 7 4 CE X2 X1 VSS NC D0 D1 VDD DTM F DATA CLK S /P D3 D2 8 9 14 13 12 11 10
DD
Tone O u tp u t
VSS
VSS
MCU
H T9200B
Rev. 1.40
8
August 30, 2004
HT9200A/HT9200B
Package Information
8-pin DIP (300mil) Outline Dimensions
A B 1 8 5 4
H C D E F G
=
I
Symbol A B C D E F G H I a
Dimensions in mil Min. 355 240 125 125 16 50 3/4 295 335 0 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 100 3/4 3/4 3/4 Max. 375 260 135 145 20 70 3/4 315 375 15
Rev. 1.40
9
August 30, 2004
HT9200A/HT9200B
8-pin SOP (150mil) Outline Dimensions
A 1
8
5 B 4
C
C' G D E F
H
=
Symbol A B C C D E F G H a
Dimensions in mil Min. 228 149 14 189 53 3/4 4 22 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 50 3/4 3/4 3/4 3/4 Max. 244 157 20 197 69 3/4 10 28 12 10
Rev. 1.40
10
August 30, 2004
HT9200A/HT9200B
14-pin SOP (150mil) Outline Dimensions
A 1
14 7
8 B
C C' G H D E F
=
Symbol A B C C D E F G H a
Dimensions in mil Min. 228 149 14 336 53 3/4 4 22 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 50 3/4 3/4 3/4 3/4 Max. 244 157 20 344 69 3/4 10 28 12 10
Rev. 1.40
11
August 30, 2004
HT9200A/HT9200B
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 8N Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 3301.0 621.5 13.0+0.5 -0.2 2.00.15 12.8+0.3 -0.2 18.20.2
SOP 14N Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 3301.0 621.5 13.0+0.5 -0.2 2.00.5 16.8+0.3 -0.2 22.20.2
Rev. 1.40
12
August 30, 2004
HT9200A/HT9200B
Carrier Tape Dimensions
P0 D
E F W C
P1
t
B0
D1
P
K0 A0
SOP 8N Symbol W P E F D D1 P0 P1 A0 B0 K0 t C SOP 14N Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 16.0+0.3 -0.1 8.00.1 1.750.1 7.50.1 1.5+0.1 1.5+0.25 4.00.1 2.00.1 6.50.1 9.50.1 2.10.1 0.30.05 13.3 Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 12.0+0.3 -0.1 8.00.1 1.750.1 5.50.1 1.550.1 1.5+0.25 4.00.1 2.00.1 6.40.1 5.200.1 2.10.1 0.30.05 9.3
Rev. 1.40
13
August 30, 2004
HT9200A/HT9200B
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5/F, Unit A, Productivity Building, Cross of Science M 3rd Road and Gaoxin M 2nd Road, Science Park, Nanshan District, Shenzhen, China 518057 Tel: 0755-8616-9908, 8616-9308 Fax: 0755-8616-9533 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 028-6653-6590 Fax: 028-6653-6591 Holmate Semiconductor, Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com
Copyright O 2004 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.40
14
August 30, 2004


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